An embedded laboratory service that clears urgent semiconductor failure-analysis queues using the buyer's existing equipment.
Added Aug 3, 2026
Medium opportunity (53%)
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Semiconductor engineering and manufacturing teams accumulate failed devices that must be diagnosed before they can correct yield, quality, or reliability problems. The work requires scarce technicians who can reproduce electrical failures, prepare delicate samples, operate microscopy and fault-isolation equipment, interpret defects, and produce formal reports. Delays leave production lots unresolved and process engineers without actionable evidence.
Provide fixed-duration, on-site backlog-clearing engagements inside the buyer's laboratory. The service receives prioritized failed devices, reproduces failures, performs electrical fault isolation and physical sample preparation, captures microscopy evidence, and delivers standardized root-cause reports with recommended process or equipment follow-up. The initial business uses customer-owned instruments, with specialized external laboratories subcontracted when the buyer lacks a required technique.
Concurrent hiring across several semiconductor companies and manufacturing regions indicates that failure-analysis capacity is a recurring operational constraint. Increasing device and package complexity also requires more specialized investigations while qualified laboratory personnel remain difficult to add quickly.
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As an Electrical Failure Analysis (EFA) Technician within the Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) organization at Micron Technology, Inc., you will support electrical characterization, failure analysis, reliability testing, and laboratory operations for NAND Flash memory and Solid-State Drive (SSD) products.
Texas Instruments is seeking a Failure Analysis Engineer to be responsible for technical functions in support of engineering activities such as characterization design, test, checkout, and modifications of assembly technologies. In this role, you will also work with die level failure analysis - circuit analysis as well as verify fail mode of die, isolate failure site and identify fail mechanism. The FA Engineer position provides the opportunity for interacting with wafer fab processing and assembly/test care-about while interfacing with Design Engineering, Product Engineering and CQE.
As a Manufacturing Failure Analysis Engineer, you will be instrumental in identifying and resolving failures in silicon, components, and systems, driving improvements in yield, quality, and reliability. On a day-to-day basis, you will define failure analysis strategies, perform hands-on lab evaluations, and thoroughly investigate electrical and mechanical characteristics to pinpoint root causes. Your work will directly contribute to advancing Intel's next-generation technologies and ensuring the success of future products.
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